In today’s miniaturized electronic landscape, thermal management isn’t just an engineering challenge—it’s the key to unlocking next-generation device performance and reliability. As processors become more powerful and devices shrink, the heat generated in confined spaces has reached critical levels, threatening both functionality and longevity. Modern electronics face thermal densities exceeding 100 W/cm², comparable to the surface of a rocket nozzle, making effective heat management not just beneficial but essential for survival.
The stakes are particularly high in emerging technologies like 5G infrastructure, …
